J2K110BJ105MV-T [TAIYO YUDEN]
Array/Network Capacitor, 6.3V, X5R, 1uF, Surface Mount, CHIP-4, CHIP, ROHS COMPLIANT;
| 型号： | J2K110BJ105MV-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Array/Network Capacitor, 6.3V, X5R, 1uF, Surface Mount, CHIP-4, CHIP, ROHS COMPLIANT 电容器 |
| 文件： | 总16页 (文件大小：509K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
notice_e-01
ARRAY TYPE MULTILAYER CERAMIC CAPACITORS
REFLOW
■ FEATURES
■ APPLICATIONS
◦ꢀHigh density and high efficiency mounting.
◦Gꢀ eneral electronic equipment
◦ꢀInternal electrodes are composed of nickel for improved cost perfor-
mance and reliability.
◦Cꢀ ommunication equipment (cellular phone, wireless applications,
etc.)
■ PART NUMBER
E 4 K 2 1 2 △ B J 1 0 4 M D － T △
❶
❷
❸
❹
❺
❻
❼
❽
❾
❿
⓫
⓬
❿Special code
⓬Internal code
Standard
△＝Blank space
❾Thickness
〔mm〕
❽Capacitance
❸End
❻Temperature
characteristics
code
❶Rated
❹Dimension
tolerance
termination
Plated
－
Standard
△
voltage〔VDC〕
A
Type （inch） L×W［mm］
096 （0302） 0.9×0.6
110 （0504） 1.37×1.0
212 （0805） 2.0×1.25
P
0.3
0.45
0.5
F
K
±1pF
±10%
±20%
K
4
B
BJ
K
V
B
A
D
J
6.3
10
16
25
50
⓫Packaging
X5R
M
L
E
T
U
φ178mm Taping
（4mm pitch）
0504, 0805 Type
B7
X7R
CH
C0H
0.6
❼Nominal capacitance
〔pF〕
example
T
F
0.8
❷Series name
2 circuits
multilayer capacitor
❺Dimension tolerance
CH
0.85
Taping
△
Standard
φ178mm
2
4
pitch
（2mm
）
104
105
100,000
△＝Blank space
4 circuits
multilayer capacitor
0302 Type
1,000,000
■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
Dimension [mm]
E2
Standard quantity [pcs]
E2
W
L
Type
Embossed
Paper tape
L
W
E1
P
T
tape
T
P
K
V
B
A
0.30±0.03
0.45±0.05
0.50±0.05
0.60±0.06
0.80±0.08
□2K096
0.9±0.05
0.6±0.05
0.23±0.10
0.36±0.10
0.125±0.075
0.45±0.05
0.64±0.10
10000
4000
－
－
（0302 inch）
E1
□2K110
（0504 inch）
P
1.37±0.07
1.00±0.08
0.2±0.10
W
□2K212
L
E2
T
2.00±0.10
2.00±0.10
1.25±0.10
1.25±0.10
0.50±0.20
0.25±0.10
0.25±0.15
0.25±0.15
1.00±0.10
0.50±0.10
D
D
0.85±0.10
0.85±0.10
4000
4000
－
－
（0805 inch）
□4K212
（0805 inch）
E1
P
■ AVAILABLE CAPACITANCE RANGE
BJ/B7
CH
096ꢁ2 circuits
110ꢁ2 circuits
212ꢁ2 circuits
212ꢁ4circuits
□4K212
096
110
□2K096
□2K110
□2K212
2 circuits 2 circuits
□2K096 □2K110
CH
Type
Type
Cap
[μF]
B/X5R
X5R
X7R
B/X5R
X5R
B/X5R X5R X7R
B/X5R
X5R
Cap
[pF]
CH
VDC
[3-digit]
102
10V 6.3V 4V 50V 25V 16V 50V 25V 16V 10V 16V 10V 6.3V 25V 10V 16V 25V 16V 10V 10V
VDC
[3-digit]
100
25V
50V
0.001
0.0022
0.0047
0.01
B
B
B
B
B
B
10
12
15
18
22
27
33
39
47
56
68
82
100
P
P
P
P
P
P
P
P
P
P
P
P
P
B
B
B
B
B
B
B
B
B
B
B
B
B
222
120
472
150
103
P
B
B
B
B
180
0.022
0.047
0.1
223
220
473
K
K
K
K
B
B
B
B
270
104
B
D
D
D
330
0.22
224
B
A
D
D
390
0.47
474
470
1.0
105
K
A
A,V
V
A
D
D
560
2.2
225
D
680
※Letters in the table indicate thickness.
820
101
※Letters in the table indicate thickness.
Temperature characteristics
Capacitance tolerance
Temp.char.Code
〔％〕
Applicable standard
Temperature range〔℃〕
－25～＋85
Ref. Temp〔. ℃〕
Capacitance change
±10［％］
±15［％］
±15［％］
±60［ppm/℃］
±60［ppm/℃］
JIS
EIA
EIA
JIS
EIA
B
20
25
25
20
25
BJ
B7
CH
±10（K）
±20（M）
X5R
X7R
CH
－55～＋85
－55～＋125
－55～＋125
－55～＋125
±10（K）
C0H
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc08_e-01
36
■ REPRESENTATIVE PART NUMBERS
●096TYPEꢁ2 circuits type
【Temperature CharacteristicꢁBJ：B/X5R】
・0.45mm thicknes（s K）
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
6.3V
J2K096 BJ473□K
J2K096 BJ104□K
J2K096 BJ224MK
J2K096 BJ474MK
A2K096 BJ105MK
X5R
X5R
X5R
X5R
X5R
0.047
0.1
±10, ±20
±10, ±20
±20
±20
±20
5
0.45±0.05
0.45±0.05
0.45±0.05
0.45±0.05
0.45±0.05
R
R
R
R
R
150%
150%
150%
150%
150%
5
0.22
0.47
1
10
10
10
4V
・0.3mm thicknes（s P）
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
Note
% Rated
voltage
〔μF〕
tolerance
10V
L2K096 BJ103□P
B/X5R
0.01
±10, ±20
5
0.3±0.03
R
200%
Capacitance tolerance code is applied to □ of part number.
【Temperature CharacteristicꢁCH：CH/C0H】
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
〔pF〕
Thickness
〔mm〕
Part number 1
Part number 2
Q
% Rated
voltage
tolerance
25V
T2K096 CH100FP
T2K096 CH120KP
T2K096 CH150KP
T2K096 CH180KP
T2K096 CH220KP
T2K096 CH270KP
T2K096 CH330KP
T2K096 CH390KP
T2K096 CH470KP
T2K096 CH560KP
T2K096 CH680KP
T2K096 CH820KP
T2K096 CH101KP
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
10
12
15
18
22
27
33
39
47
56
68
82
100
±1pF
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
600
640
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
0.3±0.03
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
700
760
840
940
1000
1000
1000
1000
1000
1000
1000
Capacitance tolerance code is applied to □ of part number.
●110TYPEꢁ2 circuits type
【Temperature CharacteristicꢁBJ：B/X5R】
・0.8mm thicknes（s A）
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
16V
10V
E2K110 BJ105□A
L2K110 BJ474□A
L2K110 BJ105□A
J2K110 BJ225□A
X5R
B/X5R
X5R
1
0.47
1
±10, ±20
±10, ±20
±10, ±20
±10, ±20
10
5
0.8±0.08
0.8±0.08
0.8±0.08
0.8±0.08
R
R
R
R
150%
200%
150%
150%
10
10
6.3V
X5R
2.2
・0.6mm thicknes（s B）
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
50V
U2K110 BJ102□B
U2K110 BJ222□B
U2K110 BJ472□B
T2K110 BJ103□B
T2K110 BJ223□B
T2K110 BJ104□B
E2K110 BJ473□B
E2K110 BJ104□B
L2K110 BJ224□B
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R*1
B/X5R
B/X5R*1
B/X5R*1
B/X5R
0.001
0.0022
0.0047
0.01
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
5
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
200%
25V
0.022
0.1
16V
10V
0.047
0.1
3.5
5
0.22
5
・0.5mm thicknes（s V）
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
10V
L2K110 BJ105MV
X5R
X5R
1
1
±20
±10, ±20
10
10
0.5±0.05
0.5±0.05
R
R
150%
150%
6.3V
J2K110 BJ105□V
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc08_e-01
37
■ REPRESENTATIVE PART NUMBERS
【Temperature CharacteristicꢁB7：X7R】
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
50V
U2K110 B7102□B
U2K110 B7222□B
U2K110 B7472□B
T2K110 B7103□B
T2K110 B7223□B
E2K110 B7473□B
E2K110 B7104□B
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.001
0.0022
0.0047
0.01
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
3.5
3.5
3.5
3.5
3.5
3.5
5
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
25V
16V
0.022
0.047
0.1
Capacitance tolerance code is applied to □ of part number.
【Temperature CharacteristicꢁCH：CH/C0H】
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
Thickness
〔mm〕
Part number 1
Part number 2
Q
Note
% Rated
voltage
〔pF〕
tolerance
50V
U2K110 CH100FB
U2K110 CH120KB
U2K110 CH150KB
U2K110 CH180KB
U2K110 CH220KB
U2K110 CH270KB
U2K110 CH330KB
U2K110 CH390KB
U2K110 CH470KB
U2K110 CH560KB
U2K110 CH680KB
U2K110 CH820KB
U2K110 CH101KB
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
CH/C0H
10
12
15
18
22
27
33
39
47
56
68
82
100
±1pF
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
600
640
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
0.6±0.06
R
R
R
R
R
R
R
R
R
R
R
R
R
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
200%
700
760
840
940
1000
1000
1000
1000
1000
1000
1000
●212TYPEꢁ2 circuits type
【Temperature CharacteristicꢁBJ：B/X5R】
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
25V
10V
T2K212 BJ105□D
L2K212 BJ225MD
B/X5R
X5R
1
±10, ±20
±20
5
0.85±0.1
0.85±0.1
R
R
200%
150%
2.2
10
Capacitance tolerance code is applied to □ of part number.
●212TYPEꢁ4 circuits type
【Temperature CharacteristicꢁBJ：B/X5R】
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
25V
16V
10V
T4K212 BJ104□D
E4K212 BJ104□D
L4K212 BJ224□D
L4K212 BJ474□D
L4K212 BJ105□D
B/X5R
B/X5R*1
B/X5R
B/X5R
X5R
0.1
0.1
±10, ±20
±10, ±20
±10, ±20
±10, ±20
±10, ±20
5
5
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
R
R
R
R
R
200%
200%
200%
200%
150%
0.22
0.47
1
5
5
10
Capacitance tolerance code is applied to □ of part number.
*1ꢁWe may provide X7R for some itemes according to the individual specification.
【Temperature CharacteristicꢁB7：X7R】
HALT
Soldering
R:Reflow
W:Wave
Internal
code
（P/N 1）
Rated
voltage
Temp.
char.
Capacitance Capacitance
tanδ
〔%〕
Thickness
〔mm〕
Part number 1
Part number 2
Note
% Rated
voltage
〔μF〕
tolerance
16V
E4K212 B7104□D
X7R
0.1
±10, ±20
5
0.85±0.1
R
200%
Capacitance tolerance code is applied to □ of part number.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc08_e-01
38
■ ELECTRICAL CHARACTERISTICS
●Example of Impedance ESR vs. Frequency characteristics
Taiyo Yuden multilayer ceramic capacitor
■
J2K096 BJ104MK
T2K096 CH100FP
T2K096 CH101KP
L2K096 BJ103MP
100000
10000
1000
100000
10000
1000
1000000
1000000
ESR
Impedance
ESR
Impedance
100000
10000
1000
100
100000
10000
1000
100
100
10
100
10
10
10
1
0.1
1
0.1
1
0.1
1
0.1
0.01
0.1
0.01
0.1
0.01
1
0.01
1
1
10
100 1000 10000100000
1
10
100 1000 10000100000
10
100
1000
10000
10
100
1000
10000
〔MHz〕
〔MHz〕
T2K110 BJ103MB / T2K110 B7103MB
E2K110 BJ104MB / E2K110 B7104MB
L2K110 BJ105MA
J2K110 BJ225MA
1000000
100000
10000
1000
100
100000
10000
1000
1000
10000
1000
100
10
100
10
1
100
10
1
10
1
0.1
1
0.1
0.1
0.01
0.1
0.01
0.01
0.01
0.001
0.1
0.001
0.1
0.001
0.1
0.001
0.1
1
10
100 1000 10000100000
1
10
100 1000 10000100000
1
10
100 1000 10000100000
1
10
100 1000 10000100000
L4K212 BJ105KD
10000
1000
100
10
1
0.1
0.01
0.001
0.1
1
10
100 1000 10000100000
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc08_e-01
39
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc08_e-01
40
■ PACKAGING
①Minimum Quantity
◦Taped package
③Representative taping dimensions
ꢁ◦Paper Tape（8mm wide）
ꢁ◦Pressed carrier tape（2mm pitch）
Thickness
mm
Standard quantity [pcs]
Type
Embossed
㧗0.1/−0
code
Paper tape
tape
□
MK042
0.2
0.3
C,D
P,T
P
—
15000
40000
□MK063
□2K096
□WK105
0.3
0.45
0.3
K
10000
P
0.2
C
20000
15000
—
T1
□MK105
□VK105
0.3
P
0.5
V, W
W
K
10000
0.5
Unit：mm
0.45
0.5
4000
Chip Cavity
Insertion Pitch
Tape Thickness
□MK107
□WK107
Type
V
—
4000
Ａ
Ｂ
Ｆ
Ｔ
T1
0.8
A
□MK063
□2K096
0.37
0.67
0.5
V
0.65
1.02
0.45max.
0.42max.
□2K110
0.6
B
□WK105
2.0±0.05
4000
—
0.8
A
MK105（*1C）
MK105（*1P）
0.65
1.15
0.4max.
0.3max.
0.45
0.85
1.25
0.85
0.85
0.85
1.15
1.25
1.6
K
0.45max.
0.42max.
□MK212
□WK212
D
*
1 Thickness, C：0.2mm、P：0.3mm
G
D
—
3000
□4K212
□2K212
◦Punched carrier tape（2mm pitch）
D
4000
—
㧗0.1/−0
D
F
□MK316
3000
2000
G
L
—
0.85
1.15
1.9
D
F
□MK325
□MK432
N
—
—
2.0max
2.5
Y
M
M
500（T）, 1000（P）
Unit：mm
Tape Thickness
2.5
500
Chip Cavity
Type
Insertion Pitch
A
B
F
T
□2K096
□MK105
□VK105
0.72
1.02
0.6max.
52.0±0.05
②Taping material
※No bottom tape for pressed carrier tape
0.65
1.15
0.8max.
◦Paper tape
◦Punched carrier tape（4mm pitch）
㧗0.1/−0
Unit：mm
Chip Cavity
Type
Insertion Pitch
F
Tape Thickness
T
◦Embossed tape
A
B
□MK107
□WK107
□2K110
1.0
1.15
1.8
1.1max.
1.0max.
1.55
□MK212
□WK212
□4K212
□2K212
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
□MK316
◦Chip filled
Note：Taping size might be different depending on the size of the product.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_pack_e-01
mlcc_pack-P1
■ PACKAGING
◦Embossed tape（4mm wide）
④Trailer and Leader
0.8±0.04
0.9±0.05
100mm or more
Trailer 160mm min.
Leader 400mm min.
1.0±0.02
2.0±0.04
Ｆ
Unit：mm
Tape Thickness
⑤Reel size
Chip Cavity
Insertion Pitch
Type
□MK042
A
B
F
K
T
t
0.23
0.43
1.0±0.02
0.5max.
0.25max.
E
C
◦Embossed tape（8mm wide）
A
㧗0.1/−0
B
D
R
W
Unit：mm
A
B
C
φ178±2.0
φ50min.
φ13.0±0.2
Unit：mm
Tape Thickness
D
E
R
Chip Cavity
Type
Insertion Pitch
F
φ21.0±0.8
2.0±0.5
1.0
A
B
K
T
□WK107
□MK212
□MK316
□MK325
1.0
1.65
2.0
2.8
1.8
2.4
3.6
3.6
1.3max
0.25±0.1
t
W
4.0±0.1
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
3.4max.
0.6max.
◦Embossed tape（12mm wide）
⑥Top Tape Strength
㧗0.1/−0
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
2.0±0.1
F
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Unit：mm
Tape Thickness
Chip Cavity
Type
Insertion Pitch
A
B
F
K
T
□MK432
3.7
4.9
8.0±0.1
4.0max.
0.6max.
12±0.1
36＋0/－0.2
110±0.7
2.0＋0/－0.1
1.5＋0.1/－0
1.0＋0/－0.1
Unit：mm
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_pack_e-01
mlcc_pack-P2
■ RELIABILITY DATA
Super Low Distortion Multilayer Ceramic Capacitors and Medium-High
Voltage Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
1.Operating Temperature Range
Standard
Temperature Compensating
（Class 1）
－55 to ＋125℃
Specification
High Frequency Type
Temperature Range
B
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－25 to ＋85℃
－30 to ＋85℃
BJ
X5R
X7R
X6S
X7S
F
Specified
Value
B7
C6
C7
High Permittivity（Class 2）
F
Y5V
2. Storage Conditions
Standard
Temperature Compensating
（Class 1）
－55 to ＋125℃
Specification
High Frequency Type
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－25 to ＋85℃
－30 to ＋85℃
B
BJ
X5R
X7R
X6S
X7S
F
Specified
Value
B7
C6
C7
High Permittivity（Class 2）
F
Y5V
3. Rated Voltage
Standard
50VDC, 25VDC, 16VDC
50VDC, 16VDC
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type
High Permittivity（Class 2）
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC
4. Withstanding Voltage（Between terminals）
Standard
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type
No breakdown or damage
High Permittivit（y Class 2）
【Test Methods and Remarks】
Class 1
Class 2
Applied voltage
Duration
Rated voltage×3 Rated voltage×2.5
1 to 5 sec.
Charge/discharge current
50mA max.
5. Insulation Resistance
Standard
Temperature Compensating
（Class 1）
10000 MΩ min.
Specified
Value
High Frequency Type
C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
High Permittivity（Class 2）Note 1
【Test Methods and Remarks】
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
6. Capacitance（Tolerance）
0.5pF≦C≦5pF：±0.25pF
0.5pF<C≦10pF：±0.5pF
C＞10pF：±5%
0.5pF≦C≦2pF：±0.1pF
C＞2pF：±5%
RH
S△
T△
C△
U△
Standard
Temperature Compensating
（Class 1）
ꢁ
Specified
Value
0.5pF≦C≦2pF：±0.1pF
C＞2pF：±5%
CH
RH
High Frequency Type
High Permittivity（Class 2）
BJ, B7, C6,C7：±10％ or ±20％, F：－20％／＋80％
【Test Methods and Remarks】
Class 1
Class 2
Standard
High Frequency Type
C≦10μF
C＞10μF
Preconditioning
None
Thermal treatment（at 150℃ for 1hr）Note 2
Measuring frequency
Measuring voltage Note 1
Bias application
1ＭHz±10％
0.5 to 5Vrms
1ｋHz±10％
1±0.2Vrms
120±10Hz
0.5±0.1Vrms
None
7. Q or Dissipation Factor
Standard
C＜30 pF：Q≧400＋20C、C≧30 pF：Q≧1000ꢁ（C：Nominal capacitance）
Refer to detailed specification
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type
High Permittivit（y Class 2）Note 1
BJ, B7, C6,C7：2.5％ max.,ꢁF：7％ max.
【Test Methods and Remarks】
Class 1
High Frequency Type
Class 2
Standard
C≦10μF
C＞10μF
Preconditioning
None
Thermal treatment（at 150℃ for 1hr）Note 2
Measuring frequency
Measuring voltage Note 1
Bias application
1ＭHz±10％
1GHz
1ｋHz±10％
1±0.2Vrms
120±10Hz
0.5±0.1Vrms
High Frequency Type
Measuring equipment: HP4291A
Measuring jig: HP16192A
0.5 to 5Vrms
None
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_reli_e-01
mlcc_reli-R1
■ RELIABILITY DATA
8. Temperature Characteristic（Without voltage application）
Temperature Characteristic［ppm/℃］
C□ ：0 CH, CJ, CK
Tolerance
Standard
R□ ：ー220 RH
H±60
J±120
K±250
Temperature Compensating
（Class 1）
S□ ：ー330 SH, SJ, SK
T□ ：ー470 TJ, TK
U□ ：ー750 UJ, UK
SL ：＋350 to －1000
High Frequency Type
Specified
Value
Specification Capacitance change Reference temperature
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－25 to ＋85℃
－30 to ＋85℃
B
±10％
±15％
20℃
25℃
25℃
25℃
25℃
20℃
25℃
BJ
X5R
X7R
X6S
X7S
F
B7
C6
C7
±15％
±22％
±22％
＋30/ー80％
＋22/ー82％
High Permittivity（Class 2）
F
Y5V
【Test Methods and Remarks】
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
（C85－C20
）
6
× 10（ppm/℃）
C20×△Tꢁꢁꢁꢁꢁꢁꢁꢁꢁꢁꢁ△T＝65
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
（C－C2）
×100（％）
Step
B、F
Minimum operating temperature
20℃ 25℃
X5R、X7R、X6S、X7S、Y5V
C2
1
2
3
C
：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
Maximum operating temperature
9. Deflection
Appearance :
No abnormality
Standard
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Temperature Compensating
（Class 1）
Specified
Value
Appearance :
Capacitance change : Within±0.5 pF
Appearance : No abnormality
Capacitance change : Within ±12.5%（BJ, B7, C6, C7）, Within ±30%（F）
No abnormality
High Frequency Type
High Permittivity（Class 2）
【Test Methods and Remarks】
Multilayer Ceramic Capacitors
Board
Thickness
0.8mm
Warp Duration
1mm 10 sec.
042、063 Type
The other types
Board
glass epoxy-resin substrate
Warp
1.6mm
Array Type
Board
Thickness
1.6mm
Warp Duration
1mm 10 sec.
Capacitance measurement shall
be conducted with the board bent
096、110、212 Type
glass epoxy-resin substrate
10. Body Strength
Standard
—
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type
No mechanical damage.
High Permittivity（Class 2）
—
【Test Methods and Remarks】
High Frequency Type
Applied force: 5N
Duration: 10 sec.
A
A
A
11. Adhesive Strength of Terminal Electrodes
Standard
High Frequency Type
Temperature Compensating
（Class 1）
Specified
Value
No terminal separation or its indication.
High Permittivity（Class 2）
【Test Methods and Remarks】
Multilayer Ceramic Capacitors
Array Type
Applied force
Duration
Applied force
Duration
042、063 Type
105 Type or more
2N
5N
096 Type
2N
5N
30±5 sec.
30±5 sec.
110、212 Type
12. Solderability
Standard
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type
At least 95% of terminal electrode is covered by new solder.
High Permittivity（Class 2）
【Test Methods and Remarks】
Solder type
H60A or H63A
Sn-3.0Ag－0.5Cu
Solder temperature
Duration
Eutectic solder
230±5℃
245±3℃
4±1 sec.
Lead-free solder
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_reli_e-01
mlcc_reli-R2
■ RELIABILITY DATA
13. Resistance to Soldering
Appearance:
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
No abnormality
Standard
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
Temperature Compensating
（Class 1）
Appearance:
Capacitance change: Within ±2.5%
Q: Initial value
No abnormality
Specified
Value
High Frequency Type
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
Appearance:
No abnormality
Capacitance change: Within ±7.5%（BJ, B7, C6, C7）
Within ±20%（F）
Initial value
High Permittivity（Class 2）ꢁNote 1
Dissipation factor:
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
【Test Methods and Remarks】
Class 1
Class 2
105 Type
Arra（y 096, 110 Type）
None
105, 107, 212 Type
Arra（y 096, 110,212 Type）
Thermal treatment（at 150℃ for 1 hr）Note 2
042, 063 Type
042、063 Type
316, 325 Type
Preconditioning
Preheating
Preconditioning
Preheating
150℃, 1 to 2 min.
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
150℃, 1 to 2 min.
80 to 100℃, 2 to 5 min. 80 to 100℃, 5 to 10 min.
150 to 200℃, 2 to 5 min. 150 to 200℃, 5 to 10 min.
Solder temp.
Duration
270±5℃
3±0.5 sec.
6 to 24 hrs（Standard condition）Note 5
Solder temp.
Duration
270±5℃
3±0.5 sec.
24±2 hrs（Standard condition）Note 5
ꢁ
Recovery
Recovery
14. Temperature Cycle (Thermal Shock）
Appearance:
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
No abnormality
Standard
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
Temperature Compensating
（Class 1）
Appearance:
Capacitance change: Within ±0.25pF
Q: Initial value
No abnormality
Specified
Value
High Frequency Type
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
Appearance:
No abnormality
Capacitance change: Within ±7.5%（BJ, B7, C6, C7）
Within ±20%（F）
Initial value
High Permittivity（Class 2）ꢁNote 1
Dissipation factor:
Insulation resistance: Initial value
Withstanding voltage（between terminals）: No abnormality
【Test Methods and Remarks】
Class 1
None
Class 2
Preconditioning
1 cycle
Thermal treatment（at 150℃ for 1 hr）Note 2
Step
Temperature（℃）
Lowest operating temperature ＋0/－3
Normal temperature
Time（min.）
30±3
2 to 3
1
2
3
4
Highest operating temperature ＋0/－3
Normal temperature
30±3
2 to 3
Number of cycles
Recovery
5 times
6 to 24 hrs（Standard condition）Note 5
24±2 hrs（Standard condition）Note 5
15. Humidity（Steady State）
Appearance:
No abnormality
Capacitance change: Within ±5% or ±0.5pF, whichever is larger.
Q： C＜10pF： Q≧200＋10Cꢁ
10≦C＜30pF： Q≧275＋2.5C
C≧30pF： Q≧350 （C：Nominal capacitance）
Insulation resistance: 1000 MΩ min.
Appearance: No abnormality
Standard
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type
Capacitance change: Within ±0.5pF,
Insulation resistance: 1000 MΩ min.
Appearance:
No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7）
Within ±30%（F）
High Permittivity（Class 2）ꢁNote 1
Dissipation factor：
5.0% max.（BJ, B7, C6, C7）
11.0% max（. F）
Insulation resistance: 50 MΩμF or 1000 MΩ whichever is smaller.
【Test Methods and Remarks】
Class 1
Class 2
Standard
40±2℃
High Frequency Type
All items
Thermal treatment（at 150℃ for 1 hr）ꢁNote 2
40±2℃
Preconditioning
Temperature
Humidity
None
Preconditioning
Temperature
Humidity
60±2℃
90 to 95％RH
90 to 95％RH
Duration
500＋24/ー0 hrs
Duration
500＋24/ー0 hrs
Recovery
6 to 24 hrs（Standard condition）Note 5
Recovery
24±2 hrs（Standard condition）Note 5
ꢁ
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_reli_e-01
mlcc_reli-R3
■ RELIABILITY DATA
16. Humidity Loading
Appearance:
No abnormality
Capacitance change: Within ±7.5% or ±0.75pF, whichever is larger.
Standard
Q：
C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200
（C：Nominal capacitance）
Temperature Compensating
（Class 1）
Insulation resistance: 500 MΩ min.
Appearance: No abnormality
Capacitance change: C≦2pF：Within ±0.4 pF
Specified
Value
High Frequency Type
C＞2pF：Within ±0.75 pF
（C：Nominal capacitance）
Insulation resistance: 500 MΩ min.
Appearance:
No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7）
Within ±30%（F）
High Permittivity（Class 2）ꢁNote 1
Dissipation factor：
5.0% max.（BJ, B7, C6, C7）
11.0% max（. F）
Insulation resistance: 25 MΩμF or 500 MΩ, whichever is smaller.
【Test Methods and Remarks】
Class 1
Class 2
Standard
High Frequency Type
All items
Preconditioning
Temperature
Humidity
None
Preconditioning
Voltage treatment
（Rated voltage are applied for 1 hour at 40℃）Note 3
40±2℃
60±2℃
Temperature
Humidity
40±2℃
90 to 95％RH
500＋24/ー0 hrs
90 to 95％RH
Duration
500＋24/ー0 hrs
Rated voltage
50mA max.
Duration
Applied voltage
Charge/discharge current
Recovery
Applied voltage
Charge/discharge current
Recovery
Rated voltage
50mA max.
6 to 24 hrs（Standard condition）Note 5
ꢁ
24±2 hrs（Standard condition）Note 5
17. High Temperature Loading
Appearance:
No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Q： C＜10pF： Q≧200＋10C
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
Insulation resistance: 1000 MΩ min.
Appearance: No abnormality
Standard
Temperature Compensating
（Class 1）
Specified
Value
High Frequency Type Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Insulation resistance: 1000 MΩ min.
Appearance:
No abnormality
Capacitance change: Within ±12.5%（BJ, B7, C6, C7）
Within ±30%（F）
High Permittivity（Class 2）ꢁNote 1
Dissipation factor：
5.0% max（. BJ, B7, C6, C7）
11.0% max（. F）
Insulation resistance: 50 MΩμF or 1000 MΩ, whichever is smaller.
【Test Methods and Remarks】
Class 1
Class 2
Standard
High Frequency Type
BJ, F
C6
B7, C7
Preconditioning
Temperature
None
Preconditioning
Voltage treatment（Twice the rated voltage shall be
applied for 1 hour at 85℃, 105℃ or 125℃）Note 3, 4
125±3℃
Temperature
Duration
85±2℃
105±3℃
1000＋48/ー0 hrs
Rated voltage×2ꢁNote 4
50mA max.
125±3℃
Duration
1000＋48/ー0 hrs
Rated voltage×2
50mA max.
Applied voltage
Charge/discharge current
Recovery
Applied voltage
Charge/discharge current
Recovery
6 to 24hr（Standard condition）Note 5
ꢁ
24±2 hrs（Standard condition）Note 5
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_reli_e-01
mlcc_reli-R4
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1.A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
◆Operating Voltage（Verification of Rated voltage）
1.The operating voltage for capacitors must always be their rated voltage or less.
Precautions
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used（size of fillet）can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
◆Pattern configuration（s Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
◆Pattern configurations（Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions（unit: mm）
ꢁWave-soldering
Land patterns for PCBs
Chip capacitor
Land
Type 107
212
2.0
316
3.2
1.6
325
3.2
2.5
L
1.6
0.8
Solder-resist
Size
W
51.25
A
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
C
B
C
B
B
A
Reflow-soldering
Type 042
063
0.6
0.3
105
1.0
0.5
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
432
4.5
3.2
Chip capacitor
L
0.4
0.2
Size
W
51.25
W
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
B
C
L
Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC
●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）
Type
105
0.52
107
50.8
212
1.25
L
W
Size
W
1.0
1.6
2.0
A
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
B
C
L
Technical
consider-
ations
●Array type: Recommended land dimensions for reflow-soldering（unit: mm）
Type 096（2 circuits）110（2 circuits）212（2 circuits） 212（4 circuits）
2 circuits
4 circuits
Chip capacitor
L
0.9
1.37
2.0
2.0
c
c
Size
W
0.6
1.0
1.25
1.25
a
b
a
a
b
a
a
0.25 to 0.35
0.15 to 0.25
0.15 to 0.25
0.45
0.35 to 0.45
0.55 to 0.65
0.3 to 0.4
0.64
0.5 to 0.6
0.5 to 0.6
0.5 to 0.6
1.0
0.5 to 0.6
0.5 to 0.6
0.2 to 0.3
0.5
b
c
d
d
d
Land
（2）Examples of good and bad solder application
Items
Not recommended
Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
To next page
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P1
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
◆Pattern configuration（s Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items
Not recommended
Recommended
Deflection of board
Technical
consider-
ations
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
◆Adjustment of mounting machine
1.When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Precautions ◆Selection of Adhesives
1.When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items
Not recommended
Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
Technical
consider-
ations
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
Adhesives shall not contact land
ꢁꢁ
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P2
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（in CI equivalent）of halogenated content. Flux having a strong acidity content shall not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
◆Soldering
• Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
• Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
• Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
• Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak 260℃ Max.
Within 10sec.
Preheating
230℃
Within 10 sec.
60sec. 60sec.
200
200
100
0
Slow
cooling
Min.
Min.
Slow cooling
100
Heating above
Preheating 150℃
230℃
Capacitor
PC board
60sec. Min.
40sec. Max.
0
Solder
T
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
Technical
consider-
ations
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak 260℃ Max.
230～250℃
Within 10sec.
Within 3sec.
Preheating
120sec. Min.
200
120sec. Min.
200
Slow
cooling
Slow cooling
Preheating
150℃
100
100
0
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
400
400
300
200
100
0
400
300
200
100
0
Peak 350℃ Max.
Peak 280℃ Max.
230～280℃
Within 3 sec.
300
Within 3sec.
Within 3sec.
⊿T
Slow cooling
Slow cooling
⊿T
200
Slow cooling
Preheating
150℃ Min.
Preheating
150℃ Min.
100
Preheating
60sec. Min.
60sec. Min.
60sec. Min.
0
⊿T
⊿T≦150℃
⊿T
⊿T≦130℃
316type or less
325type or more
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P3
■ PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning（. e.g. to
Precautions
remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may adversely affect the performance of the capacitors.
Technical
consider-
ations
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ℓor less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
Precautions
7. Handling
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
◆Storage
1.To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature
Humidity
: Below 30℃
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time,ｓo care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour.
Technical If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
consider- packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
ations
fore using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
ꢁPlease check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc_prec_e-01
mlcc_prec-P4
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